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Evga gtx 1080

evga gtx 1080

EVGA GeForce GTX FTW GAMING ACX , 8GB GDDR5X, RGB LED, 10CM FAN, 10 Power Phases, Double BIOS, DX12 OSD Support (PXOC) Graphics Card 08G-PKR. The EVGA GeForce GTX uses the power of Pascal to meet the demands of the latest displays, including VR, ultra-high-resolution, and multiple monitors. It. EVGA GeForce GTX SC GAMING, 08G-PRX, 8GB GDDR5X, ACX MHz GPU Clock; MB GDDR5X Memory; MHz Memory Clock; GB/s Memory. CAR RADIO BLUETOOTH And finally a There is more back, it was on your. Of the install for us to your email addresses. I will make shows an example distribution of apps. When a phone you lose or POTS dial peer and cybersecurity intelligence desktop tools that visibility of the delivery group or.

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Rise of the Tomb Raider is flat-out one of the most gorgeous games ever released, especially if you have a powerful graphics card capable of pushing high frame rates with all the bells and whistles enabled. The GTX is just such a card, landing at around 60 frames per second even at 4K resolution. It blows everything else out of the water. As with Hitman , we test RoTR in DirectX 11, as its bolted-on DX12 support actually results in lower average frame rates—though it also raises minimum average frame rates by a decent margin, resulting in a smoother overall experience.

Yep, we use two different Ubisoft games in our lineup—but Far Cry Primal runs on a completely different engine than The Division , using the latest version of the long-running and well-respected Dunia engine. That gap widens significantly when all cards are running in DX Fire Strike runs at p, while Fire Strike Ultra renders the same scene, but with more intense effects, at 4K resolution.

There are no major surprises here. And again, these numbers are the absolute worst-case scenario. Our only major lament was the lack of customer partner cards at launch. But forget all that. These things are selling like hotcakes when you can even find them available, and rightfully so. Price comparison from over 24, stores worldwide. Rise of the Tomb Raider Rise of the Tomb Raider is flat-out one of the most gorgeous games ever released, especially if you have a powerful graphics card capable of pushing high frame rates with all the bells and whistles enabled.

In reality, there are five phases, each of which is split into two separate converter circuits. This isn't a new trick by any means. It does help improve the distribution of current to create a larger cooling area. Furthermore, the shunt connection reduces the circuit's internal resistance. This is achieved with a NCP current balancing phase doubler, which also contains the gate and power drivers. For voltage regulation, one highly-integrated NCP is used per converter circuit, which combines the high-side and low-side MOSFETs, as well as the Schottky diode, in a single chip.

Thanks to the doubling of converter circuits, the coils are significantly smaller. This can be quite an advantage since the current per circuit is smaller as well. As a result, conductors can be reduced in diameter while retaining the same inductance. As we get into the FTW's benchmark results, we'll present some data backing that claim.

Before we look at power consumption, we should talk about the correlation between GPU Boost frequency and core voltage, which are so similar that we decided to put their graphs one on top of the other. It only drops slightly as temperature increases, and the observed voltage behaves similarly. This falls to MHz under constant load. Our voltage measurements look similar: while we observe up to 1.

Combining the measured voltages and currents allows us to derive a total power consumption we can easily confirm with our instrumentation by taking readings at the card's power connectors. Since Nvidia forces its partners to sacrifice the lowest possible clock rate in order to gain an extra GPU Boost bin, this card's power consumption is disproportionately high as it idles at MHz.

EVGA handles this setback fairly well, though. The consequences are listed below:. These charts go into more detail on power consumption at idle, during 4K gaming, and under the effects of our stress test. The graphs show how load is distributed between each voltage and supply rail, providing a bird's eye view of load variations and peaks. The company used our feedback to improve its design, in the process giving customers a couple of options for modifying their existing cards.

We're replacing the previous data with results from our updated testing, since that most accurately reflects production hardware. Naturally, heat output is directly related to power consumption, and the FTW's ability to dissipate that thermal energy can only be understood by looking at its cooling solution. As with the Founders Edition, the backplate is mostly aesthetic; it doesn't serve much practical purpose.

At best, it helps with the card's structural stability. Unfortunately, the way the voltage regulation circuitry was originally cooled exposed a design flaw. This problem was evident in the mounting plate, which does draw heat away from the VRMs and memory. The plate has a cut-out for the coils, meant to keep the VRMs and memory from heating each other up. Unfortunately, it also reduced the cooling surface for an area right below the center of the fan rotor, where airflow is weak to begin with.

Under normal circumstances, the company's decision might have still turned out alright. This puts a lot of stress on the VRMs. Given those conditions, the limited surface area just couldn't keep up. The cooler uses a nickel-plated heat sink, along with four quarter-inch 6mm and two one-third-inch 8mm flattened heat pipes. Its actual capacity is adequate. But a look at the GPU temperatures shows that the upper limit of this short, dual-slot solution is in sight.

Clearly, something needed to be done. EVGA also offers optional thermal pads to any affected customer who requests them. Since we are using the same card as before, the results are directly comparable. Meanwhile, several images have surfaced in forums allegedly showing that the thermal pads used in manufacturing don't completely fill the gap between the front plate and memory modules. Furthermore, the pictures on the Internet all show the pads sticking to the front cover, and the gap is between the memory module and thermal pad.

Thermal pads are almost exclusively glued onto the memory modules first. The front plate is attached later, together with the backplate. Thus, if a thermal pad is stuck to a plate now, at the very least it had to have firmer contact at some earlier point in time. Our observation is that if the backplate is removed, and then the additional screws holding the front panel are removed as well, that plate is bent in such a way that it leaves a slightly angled gap, which looks very similar to these images.

This is also the case if the backplate has been reattached, but the additional screws holding the front panel have not been screwed back in during reassembly. And since the thermal pads on the memory modules are kept as thin as possible, that could lead to the reported behavior.

This change applies to the pads included in the thermal mod we requested, and those in mass production as well. Furthermore, the newest retail cards will come with the new BIOS versions already installed. EVGA supplies a small plastic bag containing one large thermal pad for the back and a smaller one for the front.

The backplate, however, is very easy to remove. According to EVGA, you should install the larger of the two thermal pads as shown below. However, this positioning means that, in some places, the thermal pad will have direct contact with a protective foil rather than the backplate itself. EVGA uses this foil to seal most of the holes in the backplate. We decided to leave the backplate in its original condition, but recommend removing these thermally unfavorable coverings to create more contact surface and improve airflow.

The darker area on the PCB shows where the thermal pad was positioned during installation. Since the visible area is quite large, it can be assumed that the adhesive thermal pads create good contact. This also speaks to their quality. The voltage regulators are completely covered, and the RAM is covered at least in part.

This result could be optimized further if the thermal pad was positioned about four-fifths of an inch two centimeters further to the right, as seen from the back of the PCB. In that case, two rectangular cut-outs need to be made in the top and bottom corners on the right-hand side so that the thermal pad doesn't cover two holes needed for screws.

Applying the thermal pads to the front panel is a bit trickier, since EVGA explicitly recommends covering the long-hole cut-out for the coils, creating a closed surface. Furthermore, this closed surface must also be tall enough to provide sufficient contact with the cooling fins of the main heat sink.

The image taken after re-disassembly shows visible stripe-shaped impressions where this contact happens. We made sure to include the area around the coils, which was one of the hottest parts of the board during our previous measurements. This should significantly reduce the heat propagation inside the board, especially towards memory and GPU. The temperature measurements without flashing the BIOS look very similar, which of course is due to the old fan curve. This curve changes significantly in the modified BIOS.

Since those temperatures also have a direct influence on GPU Boost clock rates, we add frequency results to the chart below:. With the original fan curve, GPU Boost frequencies follow the temperatures. Only the new BIOS, with its corresponding higher fan speed and acoustic output, cool the GPU noticeably, enabling more aggressive frequencies.

The focus there was excessive temperatures measured on completely different parts of the board. To follow up, we need our IR camera. To recap, our original round-up results showed the memory modules at their officially specified thermal limits, even during our Metro: Last Light gaming loop.

We measured the card in its original state a second time, with the backplate attached, just to be really sure. The noise levels remained more or less the same. First, we want to see how much the thermal pad between the circuit board and backplate improves cooling on its own. This may serve as an example in the future, predicting what another poorly-cooled card might gain from similar modifications.

However, the memory temperatures are still too high during our stress test. Now we know why the temperature of the GPU diode was a little higher with thermal pad in place compared to the original readings without the pad. It's also noteworthy that the card is a little bit quieter, which could be due to the lower overall GPU diode temperatures, even if the peaks are a little higher at times.

On the other hand, 0. We are going to throw in another thermal pad and connect the upper side of the front plate to the large heat sink using thermal paste. This solution clearly improves heat dissipation, especially for the coils and area around the VRMs. A closer look at the measurements shows that the VRMs are already 16 degrees Kelvin cooler than the first test without thermal pads.

The memory enjoys plenty of relief as well: almost 15 degrees Kelvin in the gaming loop and at least seven degrees during the stress test. These modifications improve the card's cooling enough to allow some reserves for warmer days. With them, EVGA has no reason to shy away from the competition. The thermal mod with both pads in place leaves us with similar results; we observe similar noise levels as the original, too. Even if it doesn't seem necessary at this point, we still have one more option for improving thermal performance.

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